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Additionally, the current immersion cooling system design focuses mainly on single/two-phase immersion cooling with relatively simple configurations, and further development is needed in the structural design optimization and inherent heat transfer enhancement mechanism of jet impingement immersion cooling.
In liquid-cooled plate technology, heat flux from sources must be transmitted to the cooling coolant through the cold plate, while in immersion cooling technology, heat from the heat source is directly transmitted to cooling coolants.
The current work systematically reviews the research progress on immersion cooling technology in electronic device thermal management, including the properties of immersion coolants, liquid-cooled structures, immersion cooling enhancement, and current engineering applications.
Immersion cooling is considered to be a pathway for efficient thermal management. The fundamentals and screening mechanisms of immersion coolants are discussed. Liquid-cooled structures significantly impact the immersion cooling performance. The commercialization of immersion cooling technology requires further development.
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